| Global CMP Polishing Fluid Market Research Report 2020 Figure 1. CMP Working Principle 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Chemical mechanical polishing (CMP) is a key process to achieve wafer surface planarization in the manufacturing process of integrated circuits. Different from the traditional pure mechanical or pure chemical polishing method, the CMP process is to achieve the removal of micro / nano-level different materials on the wafer surface through the combination of surface chemistry and mechanical grinding technology, so as to achieve the height of the wafer surface (nano level ) The flattening effect enables the next lithography process to proceed. The main working principle of CMP is that under a certain pressure and in the presence of a polishing liquid, the polished wafer moves relative to the polishing pad, with the aid of a high degree of organic combination between the mechanical grinding effect of nano-abrasive and the chemical action of various chemical reagent To make the polished wafer surface meet the requirements of high flatness, low surface roughness and low defects. Global CMP Polishing Materials Key Players: Table 1. CMP Polishing Materials Key Players and Products 7 ^6 k, T1 a6 M3 a. Y
Players Products
7 x4 r" V e F) Y4 O人在德国 社区Cabot Microelectronics Copper CMP Polishing Slurries/ Barrier CMP Polishing Slurries/Aluminum CMP Polishing Slurries/ Rigid Disk CMP Slurries/ Dielectric CMP Polishing Slurries/ Tungsten CMP Polishing Slurries/ TSV Through-Silicon Via CMP Polishing Slurries/ Silicon Wafer CMP Polishing Slurries/Silicon Carbide Wafer Polishing Slurries 2 r9 |% b2 D8 a9 V/ E
Dow OPTIPLANE™/ KLEBOSOL™/ ACUPLANE™
! ^6 V! \1 U. h# |Fujimi Incorporated PLANERLITE 4000 Series/ PLANERLITE 5000 Series/ PLANERLITE 6000 Series/ PLANERLITE 6500 Series/ PLANERLITE 7000 Series/ PLANERLITE 8000 Series 人在德国 社区1 V. e" _* ]0 e( z. a! L! c
Merck KGaA (Versum Materials) Da Nano Barrier CMP Slurries/ Da Nano Copper CMP Slurries/ Da Nano Sti CMP Slurries/ Da Nano Tungsten/ CMP Slurries 9 D# v5 [& X+ ~: P. L; o
FujiFilm Copper CMP Slurries/ Barrier CMP Slurries/ Front End CMP Slurries/ TSV CMP Slurries 2 M) B8 L1 e4 m' d% P' G3 A* A
Hitachi Chemical HS-8005/HS-C, H/HS-T/HS-A/HS-P/HS-S/HS-J
, T: P0 C; x) h5 K" C0 f! V! a0 @Saint-Gobain Alumina/ Diamond-UDD/ Zirconia
4 p |5 G0 c1 g. L, aAce Nanochem ACESOL®/ ACESOL®WP
5 F8 n' L7 H- P1 DFerro Corporation (Acquired UWiZ Technology) CERIUM OXIDE SLURRIES FOR STI CMP/ CMP SLURRIES FOR BARE SILICON WAFERS/ CMP SLURRIES FOR RECLAIM WAFERS/ CMP SLURRY PRODUCTS FOR SILICON CARBIDE SUBSTRATES/ COPPER BARRIER CMP SLURRIES FOR METAL REMOVAL/ COPPER CMP SLURRIES FOR METAL REMOVAL
2 m) n# d, h$ h, F- ~7 P0 lSource: Secondary Sources, Expert Interviews and QYResearch, 2020 At present, the global CMP polishing material manufacturers are mainly overseas manufacturers, including Cabot, Hitachi, Fujimi, Versum, Dow and so on. Among them, the major manufacturers of CMP polishing liquids Cabot, Hitachi, Fujimi, Versum, Dow and Anji Technology accounted for 36.0%, 15.0%, 11.0%, 10.0%, 6.0% and 2.5%, respectively, and the top four manufacturers accounted for approximately 72%, the industry concentration is relatively high. Figure 2. Global CMP Polishing Materials Key Players Market Share 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Figure 3. Global CMP Polishing Materials Region Market Share 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 CMP Polishing Materials Classification CMP materials mainly include polishing liquid, polishing pad, regulator, CMP cleaning and other consumables, while polishing liquid and polishing pads account for more than 80% of the CMP material market segment and are the core material of the CMP process. Figure 4. Global CMP Polishing Materials Classification Market Share 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Figure 5. Global CMP Polishing Materials Classification Revenue 2015-2019 (US$ Million) 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Polishing fluid and polishing pad are important materials in chemical mechanical polishing. The polishing liquid is a mixture of abrasive materials and chemical additives in the planarization process. The materials of the abrasive liquid are mainly quartz, alumina and cerium oxide. The chemical additives should be selected according to the actual situation. These chemical additives and the materials to be removed are carried out. The reaction weakens its bond with silicon molecules, making mechanical polishing easier. In terms of abrasives, there are usually oxide abrasives, metal tungsten abrasives, metal copper abrasives and some special application abrasives Polishing pads are usually made of polyurethane materials, also known as polyurethane polishing pads, polishing damping cloth, and cerium oxide polishing pads. The use of this porous material like sponge's mechanical properties and porous properties can improve the uniformity of polishing. A window can be opened on the polishing pad to facilitate online testing. The polishing pad mainly stores the polishing liquid and transports it to the entire processing area of the workpiece, makes the polishing uniform, removes residues generated during the polishing process, transfers the mechanical energy required for material removal, and maintains the mechanical and chemical environment required for the polishing process effect. CMP Polishing Materials Applications By the end users/application, this report covers the following segments Wafers Optical Substrate Disk Drive Components Others Figure 6. Global CMP Polishing Materials Applications Market Share 
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Figure 7. Global CMP Polishing Materials Market Size 2015-2026 (US$ Million)
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the CMP Polishing Materials market in 2020. COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets. The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future. This report also analyses the impact of Coronavirus COVID-19 on the CMP Polishing Materials industry. Based on our recent survey, we have several different scenarios about the CMP Polishing Materials YoY growth rate for 2020. The probable scenario is expected to grow by a xx% in 2020 and the revenue will be xx in 2020 from US$ xx million in 2019. The market size of CMP Polishing Materials will reach US$ xx in 2026, with a CAGR of xx% from 2020 to 2026. Figure 8. Global CMP Polishing Materials Production 2015-2026 (Kilotons)
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 Figure 9. China CMP Polishing Materials Market Size 2015-2019 (US$ Million)
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 The main driver of the polishing material market growth In the continuous advancement of semiconductor integrated circuit technology, a variety of new technologies and new substrate materials will inevitably appear. These new technologies and new substrate materials put forward many new requirements for polishing process materials. QYR believes that the main driving factors for the growth of the polishing materials market are as follows: 1. The capacity of downstream fabs is increased; 2. The proportion of advanced process capacity is increased.
( o; `4 A B+ w/ W9 RRegarding the improvement of downstream production capacity, the demand for CMP polishing materials will also increase. In terms of increasing the proportion of advanced processes, with the development of silicon wafer process technology, the number of polishing steps required increases, and the demand for polishing materials will also increase. Specifically, more advanced logic chip processes will require polishing of new materials, which will bring more growth opportunities for CMP polishing materials. For example, the critical CMP process required by logic chip processes below 14 nanometers will reach more than 20 steps. The polishing liquid will increase from five or six kinds of polishing liquids at 90 nanometers to more than twenty types, and the types and dosages increase rapidly; the CMP polishing step in logic chip processes of 7 nanometers and below may even reach 30 steps, and the types of polishing liquid used are close to three Ten kinds. Similarly, the transformation of memory chips from 2D NAND to 3D NAND technology will also nearly double the number of CMP polishing steps.
* q0 k i5 x% T4 n g- l3 Y3 C9 r: \人在德国 社区Global DRAM and NAND Demand Growth
Source: Secondary Sources, Expert Interviews and QYResearch, 2020 QY Research has recently curated a research report titled, Global CMP Polishing Fluid Market Research Report 2020. The report is structured on primary and secondary research methodologies that derive historic and forecast data. The global CMP Polishing Fluid market is growing remarkably fast and is likely to thrive in terms of volume and revenue during the forecast period. Readers can gain insight into the various opportunities and restraints shaping the market. The report demonstrates the progress and bends that will occur during the forecast period. Global CMP Polishing Fluid Market: Drivers and Restrains The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of sales about the global market and also about each type from 2015 to 2026. This section mentions the volume of sales by region from 2015 to 2026. Pricing analysis is included in the report according to each type from the year 2015 to 2026, manufacturer from 2015 to 2020, region from 2015 to 2020, and global price from 2015 to 2026. A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better. Global CMP Polishing Fluid Market: Segment Analysis The research report includes specific segments such as application and product type. Each type provides information about the sales during the forecast period of 2015 to 2026. The application segment also provides revenue by volume and sales during the forecast period of 2015 to 2026. Understanding the segments helps in identifying the importance of different factors that aid the market growth. Global CMP Polishing Fluid Market: Regional Analysis The research report includes a detailed study of regions of North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. The report has been curated after observing and studying various factors that determine regional growth such as economic, environmental, social, technological, and political status of the particular region. Analysts have studied the data of revenue, sales, and manufacturers of each region. This section analyses region-wise revenue and volume for the forecast period of 2015 to 2026. These analyses will help the reader to understand the potential worth of investment in a particular region. Global CMP Polishing Fluid Market: Competitive Landscape This section of the report identifies various key manufacturers of the market. It helps the reader understand the strategies and collaborations that players are focusing on combat competition in the market. The comprehensive report provides a significant microscopic look at the market. The reader can identify the footprints of the manufacturers by knowing about the global revenue of manufacturers, the global price of manufacturers, and sales by manufacturers during the forecast period of 2015 to 2019. Following are the segments covered by the report are: Alumina Slurry Colloidal Silica Slurry Ceria Slurries By Application: Silicon Wafers Optical Substrate Disk Drive Components Other Key Players: The Key manufacturers that are operating in the global CMP Polishing Fluid market are: Cabot Microelectronics Dow Versum Materials (Merck KGaA) Fujifilm Hitachi Chemical Saint-Gobain Asahi Glass Ace Nanochem UWiZ Technology (Ferro) WEC Group Anji Microelectronics Competitive Landscape The analysts have provided a comprehensive analysis of the competitive landscape of the global CMP Polishing Fluid market with the company market structure and market share analysis of the top players. The innovative trends and developments, mergers and acquisitions, product portfolio, and new product innovation to provide a dashboard view of the market, ultimately providing the readers accurate measure of the current market developments, business strategies, and key financials. for more information please go https://www.qyresearch.com/index/detail/1603963/global-cmp-polishing-fluid-market and you can go https://www.qyresearch.comto know more and more if you need any help you can contact qifeifei@qyresearch.com / telephone number ：18910840196 00861082945717 QY Research support best market reports for you. | 
发表于 2020-4-17 03:35
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